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SPM1006 Datasheet(PDF) 18 Page - Sumida Corporation

Part No. SPM1006
Description  4-28V Input 8A Output Power Supply in Inductor (PSI2) Module
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Maker  SUMIDA [Sumida Corporation]
Homepage  http://www.sumida.com
Logo SUMIDA - Sumida Corporation

SPM1006 Datasheet(HTML) 18 Page - Sumida Corporation

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Version 1.5
March 16, 2016
Page 18 of 22
Fig. 30 Output current derating (24V input)
For more information refer to Application Note PM_AN-3 ?SPM1006 Current Ratings?.
The absolute maximum operating junction temperature is 150°C and it is recommended to keep the operating
temperature well below this value under worst-case conditions. Maximum recommended case temperature is 115°C,
which corresponds to a junction temperature of approximately 125°C.
The thermal resistance from case to ambient (?CA) depends on the PCB layout as well as the amount of cooling airflow.
When mounted on the EVM, ?CA is approximately 15°C/watt in still air. Please refer to the EVM User Guide for EVM
PCB layout information.
The SPM1006 implements an internal thermal shutdown to protect itself against over-temperature conditions. When
the junction temperature of the power MOSFET is above 150°C, the power module stops operating to protect itself
from thermal damage. When the MOSFET temperature reduces to approximately 135°C (with hysteresis of 15°C),
SPM1006 will restart automatically.
Layout Considerations
To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Some considerations for
an optimized layout are:
? Use large copper areas for power planes (PVIN, VOUT, and PGND) to minimize conduction loss and thermal
? Place ceramic input and output capacitors close to the module pins to minimize high frequency noise;
? Locate additional output capacitors between the main ceramic capacitor and the load;
? Connect AGND plane and PGND plane at single point;
? Place resistors and capacitors connected to SENSE and VADJ pins as close as possible to their respective pins;
? Do not connect PHASE pin to other components;
? Use multiple vias to connect the power planes to internal layers.
Refer to SPM1006 Evaluation Module (EVM) User Manual for suggested PCB layout.

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