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ADS8322 Datasheet(PDF) 2 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation. Click here to check the latest version.
Part No. ADS8322
Description  16-Bit, 500kHz, MicroPower Sampling ANALOG-TO-DIGITAL CONVERTER
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Maker  BURR-BROWN [Burr-Brown (TI)]
Homepage  http://www.burr-brown.com
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ADS8322 Datasheet(HTML) 2 Page - Burr-Brown (TI)

 
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ADS8322
2
SBAS215
20
CLOCK
An external CMOS compatible clock can be applied
to the CLOCK input to synchronize the conversion
process to an external source.
21
CONVST
Convert Start
22
RD
Synchronization pulse for the parallel output.
23
BYTE
Selects 8 most significant bits (LOW) or 8 least
significant bits (HIGH). Data valid on pins 9-16.
24
CS
Chip Select
25
–IN
Inverting Input Channel
26
+IN
Noninverting Input Channel
27
AGND
Analog Ground
28
+VA
Analog Power Supply, +5VDC.
29
NC
No Connect
30
NC
No Connect
31
REFIN
Reference Input. When using the internal 2.5V refer-
ence tie this pin directly to REFOUT.
32
REFOUT
Reference Output. A 0.1
µF capacitor should be con-
nected to this pin when the internal reference is
used.
ABSOLUTE MAXIMUM RATINGS(1)
+IN to GND ................................................................................ VA + 0.1V
–IN to GND ....................................................................................... +0.5V
VA to GND ............................................................................. –0.3V to +7V
Digital Input Voltage to GND ................................... –0.3V to (VA + 0.3V)
VOUT to GND ............................................................ –0.3V to (VA + 0.3V)
Operating Temperature Range ...................................... –40
°C to +105°C
Storage Temperature Range ......................................... –65
°C to +150°C
Junction Temperature (TJ max) .................................................... +150°C
TQFP Package:
Power Dissipation ................................................... (TJ max – TA)/θJA
θ
JA Thermal Impedance ......................................................... 240°C/W
Lead Temperature:
Vapor Phase (soldering, 60s) ................................................. +215
°C
Infrared (soldering, 15s) .......................................................... +220
°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PIN
NAME
DESCRIPTION
1
DB15
Data Bit 15 (MSB)
2
DB14
Data Bit 14
3
DB13
Data Bit 13
4
DB12
Data Bit 12
5
DB11
Data Bit 11
6
DB10
Data Bit 10
3
DB9
Data Bit 9
8
DB8
Data Bit 8
9
DB7
Data Bit 7
10
DB6
Data Bit 6
11
DB5
Data Bit 5
12
DB4
Data Bit 4
13
DB3
Data Bit 3
14
DB2
Data Bit 2
15
DB1
Data Bit 1
16
DB0
Data Bit 0 (LSB)
17
BUSY
High when a conversion is in progress.
18
+VD
Digital Power Supply, +5VDC.
19
DGND
Digital Ground
PIN ASSIGNMENTS
MAXIMUM
NO
INTEGRAL
MISSING
PACKAGE
SPECIFICATION
LINEARITY
CODES
DRAWING
TEMPERATURE
ORDERING
TRANSPORT
PRODUCT
ERROR (LSB)
ERROR (LSB)
PACKAGE
NUMBER
RANGE
NUMBER(1)
MEDIA
ADS8322Y
±8
14
TQFP-32
351
–40
°C to 85°C
ADS8322Y/250
Tape and Reel
"
"
"""
"
ADS8322Y/2K
Tape and Reel
ADS8322YB
±6
15
TQFP-32
351
–40
°C to 85°C
ADS8322YB/250
Tape and Reel
"
"
"""
"
ADS8322YB/2K
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces
of “ADS8322Y/2K” will get a single 2000-piece Tape and Reel.
PIN CONFIGURATION
Top View
TQFP
PACKAGE/ORDERING INFORMATION
PIN
NAME
DESCRIPTION
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
CS
BYTE
RD
CONVST
CLOCK
DGND
+V
D
BUSY
9
101112131415
16
32
31
30
29
28
ADS8322
27
26
25
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes
could cause the device not to meet its published specifications.


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