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SN74LVT16240 Datasheet(PDF) 1 Page - Texas Instruments

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Part No. SN74LVT16240
Description  3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVT16240 Datasheet(HTML) 1 Page - Texas Instruments

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FEATURES
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1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
SN54LVT16240 . . . WD PACKAGE
SN74LVT16240 . . . DGG OR DL PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
SN54LVT16240
,, SN74LVT16240
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS717A – APRIL 2000 – REVISED NOVEMBER 2006
• Members of the Texas Instruments Widebus™
Family
• State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V Operation
and Low Static-Power Dissipation
• Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
CC)
• Support Unregulated Battery Operation Down
to 2.7 V
• Typical V
OLP (Output Ground Bounce) <0.8 V
at V
CC = 3.3 V, TA = 25°C
• I
off and Power-Up 3-State Support Hot
Insertion
• Distributed V
CC and GND Pins Minimize
High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB
Layout
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
• Package Options Include Plastic Shrink
Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package Using
25-mil Center-to-Center Spacings
The 'LVT16240 devices are 16-bit buffers and line drivers designed specifically for low-voltage (3.3-V) VCC
operation, but with the capability to provide a TTL interface to a 5-V system environment.
These devices are designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide
inverting outputs and symmetrical active-low output-enable (OE) inputs.
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2000–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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