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B57220K0212A003 Datasheet(PDF) 11 Page - TDK Electronics

Part No. B57220K0212A003
Description  Leadless NTCs
Download  17 Pages
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Maker  TDK [TDK Electronics]
Homepage  http://www.tdk.com

B57220K0212A003 Datasheet(HTML) 11 Page - TDK Electronics

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Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
°C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
SMDs with nickel barrier termination:
12 months
SMDs with AgPd termination:
6 months
Leaded components:
24 months
Temperature measurement and compensation
Leadless NTCs
Page 11 of 17
Please read Cautions and warnings and
Important notes at the end of this document.

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