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B57220K0212A003 Datasheet(PDF) 8 Page - TDK Electronics

Part No. B57220K0212A003
Description  Leadless NTCs
Download  17 Pages
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Maker  TDK [TDK Electronics]
Homepage  http://www.tdk.com
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B57220K0212A003 Datasheet(HTML) 8 Page - TDK Electronics

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 8 / 17 page
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Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Sn-Pb eutectic assembly
Pb-free assembly
Preheat and soak
- Temperature min
Tsmin
100
°C
150
°C
- Temperature max
Tsmax
150
°C
200
°C
- Time
tsmin to tsmax 60 ... 120 s
60 ... 180 s
Average ramp-up rate
Tsmax to Tp
3
°C/ s max.
3
°C/ s max.
Liquidous temperature
TL
183
°C
217
°C
Time at liquidous
tL
60 ... 150 s
60 ... 150 s
Peak package body temperature
Tp1)
220
°C ... 235 °C2)
245
°C ... 260 °C2)
Time (tP)3) within 5
°C of specified
classification temperature (Tc)
20 s3)
30 s3)
Average ramp-down rate
Tp to Tsmax
6
°C/ s max.
6
°C/ s max.
Time 25
°C to peak temperature
maximum 6 min
maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Temperature measurement and compensation
B57220K
Leadless NTCs
K220
Page 8 of 17
Please read Cautions and warnings and
Important notes at the end of this document.


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