H1: Classification Reflow Profile for SMT components:
H2: Classification Reflow Profile:
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (ts) from (Tsmin to Tsmax)
Ramp-up rate (TL to TP)
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak package body temperature (Tp)
Time within 5°C of actual peak temperature (tp)
Ramp-down rate (TP to TL)
Time 25°C to peak temperature
120 seconds max.
3°C/ second max.
60 seconds max.
10 seconds max.
6°C/ second max.
220 seconds max.
2 cycles max.
H Soldering Specifications:
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.