PGA2310

SBOS207B − OCTOBER 2001 − REVISED JUNE 2004

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2

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to

damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

PGA2310

UNIT

VA+

+16.0

V

Supply voltage

VA−

−16.0

V

Supply voltage

VD+

+6.5

V

Analog input voltage

0 to VA+, VA−

V

Digital input voltage

−0.3 to VD+

V

Operating temperature range

−55 to +125

°C

Storage temperature range

−65 to +150

°C

Junction temperature

+150

°C

Lead temperature (soldering, 10s)

+300

°C

Package temperature (IR, reflow, 10s)

+235

°C

(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those specified is not implied.

PRODUCT

PACKAGE−LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

DIP-16

N

PGA2310PA

PGA2310PA

Rails, 25

PGA2310

SOL-16

DW

−40

°C to +85°C

PGA2310UA

PGA2310UA

Rails, 48

PGA2310

SOL-16

DW

−40 C to +85 C

PGA2310UA

PGA2310UA/1K

Tape and Reel, 1000

(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.