NCP1207

http://onsemi.com

3

Figure 2. Internal Circuit Architecture

+

−

HV

GND

Drv

Demag

−

+

Fault

Mngt.

+

−

7.0

mA

To Internal

Supply

+

12 V, 10 V,

5.3 V (fault)

PON

4.5

ms

Delay

+

+

5.0 V

OVP

/1.44

8.0

ms

Blanking

−

+

5.0

ms

Timeout

Demag

Demag

Overload?

Timeout

Reset

S

R

S*

Q

R*

Q

380 ns

L.E.B.

/3

1.0 V

10 V

50 mV

CS

FB

200

mA

when Drv

is OFF

Driver: src = 20

sink = 10

*S and R are level triggered whereas S is edge

triggered. R has priority over the other inputs.

4.2 V

Soft−Start = 1 ms

MAXIMUM RATINGS

Rating

Symbol

Value

Units

Power Supply Voltage

16

V

Pin 1 (Demag)

−

−0.3 to 10

V

ESD diodes are activated

−

5.0

mA

Maximum Current in Pin 1

Idem

+3.0/−2.0

mA

Thermal Resistance, Junction−to−Case

57

°C/W

Thermal Resistance, Junction−to−Air, SOIC version

178

°C/W

Thermal Resistance, Junction−to−Air, PDIP version

100

°C/W

Maximum Junction Temperature

150

°C

Temperature Shutdown

−

155

°C

Hysteresis in Shutdown

−

30

°C

Storage Temperature Range

−

−60 to +150

°C

ESD Capability, HBM Model (All pins except HV)

−

2.0

kV

ESD Capability, Machine Model

−

200

V

500

V

40

V

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.