Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

203034F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 13, 2015

1

DATA SHEET

Module

Applications

 Smart meters

 In-home appliances

 Smart thermostats

Features

 Integrated PA with up to +22.5 dBm output power

 Integrated LNA with programmable bypass

 Integrated antenna switching with transmit and receive diversity

function

 Low noise figure: 2 dB typical

 Differential transmit/receive interface with integrated baluns

 Fast switch on/off time: <800 ns

 Supply range: 2.0 V to 3.6 V

 Sleep mode current: 0.05 μA typical

 No bias resistor is required

 Small MCM (20-pin, 3 x 4 x 0.9 mm) package, NiPdAu-plated

(MSL3, 240 °C per JEDEC-J-STD-020)

all applicable legislation and are halogen-free.

For additional information, refer to Skyworks

SQ04–0074.

Y0306

1

GND

TXP

TXN

VB_OUT

RXP

RXN

VCC2

GND

ANT_SEL

ANT1

GND

2

3

4

5

6

14

15

16

13

12

11

20

19

18

17

89

10

7

GND

Figure 2. SKY66109-11 Pinout

(Top View)

PA

LNA

Balun

RXP

RXN

Logic

control

TXP

TXN

ANT1

ANT2

VB_OUT

Balun

S2659

Figure 1. SKY66109-11 Functional Block Diagram

Description

The SKY66109-11 is a high-performance, fully integrated RF

front-end module (FEM) designed for ZigBee®/Smart Energy

applications.

The SKY66109-11 is designed for ease of use and maximum

flexibility. The device provides integrated and fully matched input

baluns, an integrated interstage matching and harmonic filter, and

digital controls compatible with 1.6 to 3.6 V CMOS levels.

The RF blocks operate over a wide supply voltage range from

2.0 V to 3.6 V that allows the SKY66109-11 to be used in battery

powered applications over a wide spectrum of the battery

discharge curve.

The SKY66109-11 is provided in a small, 20-pin, 3 x 4 mm Multi-

Chip Module (MCM) package. A functional block diagram is

shown in Figure 1. The pin configuration and package are shown

in Figure 2. Signal pin assignments and functional pin

descriptions are provided in Table 1.