DATA SHEET • SKY65174-21: WLAN PAM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F

4.3

4.3

4.4

8X 0.875

0.125

4X 0.875

0.5 Pitch

10X 0.3

Pin 1

Pin 1 Indicator

(0.20 x 45°)

2X 1.825

Component

Outline

Component

Outline

Component

Outline

Stencil aperture size for center

ground pad should be 80% to 100%

(by area) of solder mask opening.

Opening size of 60 to 100%

of exposed center opening shown

Pin 1

Pin 1 Indicator

(0.20 x 45°)

Stencil Aperture

Top View

Metallization

Top View

Thermal Via Array,

∅0.3 mm on 0.6 mm pitch

will improve thermal performance.

NOTE: thermal vias should

be tented and filled with solder

mask, 30-35 mm Cu plating

recommended.

Solder Mask Opening

Top View

S2038

All dimensions are in millimeters

10X 0.7

6X 0.7

0.25 Typ

Pin 10

10X 0.8

2X 0.938

Pin 10

Pin 10

0.5 Pitch

0.5 Pitch

0.125 Typ

4X 0.763

Pin 1

10X 0.4

6X 0.3

4X 0.875

Figure 16. PCB Layout Footprint for the SKY65174-21 4 x 4 mm MCM