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ADuM231E0BRIZ Datasheet(PDF) 9 Page - Analog Devices |
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ADuM231E0BRIZ Datasheet(HTML) 9 Page - Analog Devices |
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9 / 21 page  Data Sheet ADuM230D/ADuM230E/ADuM231D/ADuM231E Rev. A | Page 9 of 21 INSULATION AND SAFETY RELATED SPECIFICATIONS For additional information, see www.analog.com/icouplersafety. Table 9. RW-16 Wide Body [SOIC_W] Package Parameter Symbol Value Unit Test Conditions/Comments Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration Minimum External Air Gap (Clearance) L (I01) 7.8 mm min Measured from input terminals to output terminals, shortest distance through air Minimum External Tracking (Creepage) L (I02) 7.8 mm min Measured from input terminals to output terminals, shortest distance path along body Minimum Clearance in the Plane of the Printed Circuit Board (PCB Clearance) L (PCB) 8.1 mm min Measured from input terminals to output terminals, shortest distance through air, line of sight, in the PCB mounting plane Minimum Internal Gap (Internal Clearance) 25.5 μm min Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >400 V DIN IEC 112/VDE 0303 Part 1 Material Group II Material Group (DIN VDE 0110, 1/89, Table 1) Table 10. RI-16 -2 Wide Body Increased Creepage [SOIC_IC] Package Parameter Symbol Value Unit Test Conditions/Comments Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration Minimum External Air Gap (Clearance) L (I01) 8.3 mm min Measured from input terminals to output terminals, shortest distance through air Minimum External Tracking (Creepage) L (I02) 8.3 mm min Measured from input terminals to output terminals, shortest distance path along body Minimum Clearance in the Plane of the Printed Circuit Board (PCB Clearance) L (PCB) 8.3 mm min Measured from input terminals to output terminals, shortest distance through air, line of sight, in the PCB mounting plane Minimum Internal Gap (Internal Clearance) 25.5 μm min Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >400 V DIN IEC 112/VDE 0303 Part 1 Material Group II Material Group (DIN VDE 0110, 1/89, Table 1) PACKAGE CHARACTERISTICS Table 11. Parameter Symbol Min Typ Max Unit Test Conditions/Comments Resistance (Input to Output)1 RI-O 1013 Ω Capacitance (Input to Output)1 CI-O 2.2 pF f = 1 MHz Input Capacitance2 CI 4.0 pF IC Junction to Ambient Thermal Resistance θJA 45 °C/W Thermocouple located at center of package underside 1 The device is considered a 2-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. 2 Input capacitance is from any input data pin to ground. |
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