Electronic Components Datasheet Search |
|
ADV3224-EVALZ Datasheet(PDF) 7 Page - Analog Devices |
|
ADV3224-EVALZ Datasheet(HTML) 7 Page - Analog Devices |
7 / 24 page Data Sheet ADV3224/ADV3225 Rev. B | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Analog Supply Voltage (AVCC to AVEE) 11 V Digital Supply Voltage (DVCC to DGND) 6 V Supply Potential Difference (AVCC − DVCC) ±0.5 V Ground Potential Difference (AGND − DGND) ±0.5 V Maximum Potential Difference (DVCC − AVEE) 11 V Analog Input Voltage AVEE < VIN < AVCC Digital Input Voltage DGND < DIN < DVCC Exposed Paddle Voltage AGND Output Voltage (Disabled Analog Output) AVEE < VOUT < AVCC Output Short-Circuit Duration Momentary Current Internally limited to 55 mA Temperature Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Thermal Resistance Package Type θJA θJC Unit 72-Lead LFCSP_VQ 29 0.5 °C/W POWER DISSIPATION The ADV3224/ADV3225 operate with ±5 V supplies and can drive loads down to 100 Ω, resulting in a wide range of possible power dissipations. For this reason, extra care must be taken when derating the operating conditions based on ambient temperature. Packaged in the 72-lead LFCSP, the ADV3224/ADV3225 junction- to-ambient thermal impedance (θJA) is 29°C/W. For long-term reliability, the maximum allowed junction temperature of the die should not exceed 125°C; even temporarily exceeding this limit can cause a shift in parametric performance due to a change in stresses exerted on the die by the package. Exceeding a junction temperature of 150°C for an extended period can result in device failure. In Figure 4, the curve shows the range of allowed internal die power dissipation that meets these condi- tions over the −40°C to +85°C ambient temperature range. When using Figure 4, do not include the external load power in the maximum power calculation, but do include the load current dropped on the die output transistors. 0 1 2 3 4 5 6 7 –40 –20 0 20 40 60 80 AMBIENT TEMPERATURE (°C) TJ = 150°C Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature ESD CAUTION |
Similar Part No. - ADV3224-EVALZ |
|
Similar Description - ADV3224-EVALZ |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |