1IN−

2IN−

1IN+

GND

SHDN

2IN+

1OUT

NC

2OUT

1

2

3

5

7

9

10

8

4

6

4

TLV341, TLV341A, TLV342, TLV342S

SLVS568D – JANUARY 2005 – REVISED APRIL 2016

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Product Folder Links: TLV341 TLV341A TLV342 TLV342S

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(1)

NC – No internal connection

TLV342S RUG Package

10-Pin X2QFN

Top View

Pin Functions: TLV342S

PIN

I/O

DESCRIPTION

NAME

NO.

1IN+

1

I

Noninverting input on channel 1

1IN–

10

I

Inverting input on channel 1

1OUT

9

O

Output on channel 1

2IN+

4

I

Noninverting input on channel 2

2IN–

5

I

Inverting input on channel 2

2OUT

6

O

Output on channel 2

GND

2

—

Ground

8

—

Not connected

SHDN

3

I

Shutdown active low

7

—

Positive power supply

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values (except differential voltages) are with respect to the network GND.

(3)

Differential voltages are at IN+ with respect to IN

−.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

5.5

V

±5.5

V

Input voltage (either input or shutdown)

–0.3

5.5

V

Output voltage

–0.3

V

Operating virtual-junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±750