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TLV341A Datasheet(PDF) 5 Page - Texas Instruments |
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TLV341A Datasheet(HTML) 5 Page - Texas Instruments |
5 / 36 page 5 TLV341, TLV341A, TLV342, TLV342S www.ti.com SLVS568D – JANUARY 2005 – REVISED APRIL 2016 Product Folder Links: TLV341 TLV341A TLV342 TLV342S Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated 6.3 Recommended Operating Conditions MIN MAX UNIT V+ Supply voltage (single-supply operation) 1.5 5.5 V TA Operating free-air temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information: TLV341 THERMAL METRIC(1) TLV341 UNIT DBV (SOT-23) DCK (SC70) DRL (SOT) 6 PINS 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 193.4 196.8 221.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 145.6 82.4 109.1 °C/W RθJB Junction-to-board thermal resistance 44.1 95.2 111.4 °C/W ψJT Junction-to-top characterization parameter 34.1 1.8 6.2 °C/W ψJB Junction-to-board characterization parameter 43.4 93.2 109.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information: TLV342 THERMAL METRIC(1) TLV342 UNIT D (SOIC) DGK (MSOP) RUG (X2QFN) 8 PINS 8 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 123.6 192.3 167 °C/W RθJC(top) Junction-to-case (top) thermal resistance 69.8 78.2 56.5 °C/W RθJB Junction-to-board thermal resistance 63.9 112.6 94.3 °C/W ψJT Junction-to-top characterization parameter 24.4 15.2 4.1 °C/W ψJB Junction-to-board characterization parameter 63.4 111.2 94 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.6 Thermal Information: TLV342S THERMAL METRIC(1) TLV342S UNIT RUG (X2QFN) 10 PINS RθJA Junction-to-ambient thermal resistance 158.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52.6 °C/W RθJB Junction-to-board thermal resistance 87.9 °C/W ψJT Junction-to-top characterization parameter 1 °C/W ψJB Junction-to-board characterization parameter 87 °C/W |
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