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INA199-Q1

SBOS781A – MARCH 2016 – REVISED MAY 2016

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(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

Machine model (MM)

±100

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input voltage

12

V

Operating supply voltage (applied to V+)

5

V

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

INA199-Q1

UNIT

DCK (SC70)

6 PINS

Junction-to-ambient thermal resistance

227.3

°C/W

Junction-to-case (top) thermal resistance

79.5

°C/W

Junction-to-board thermal resistance

72.1

°C/W

Junction-to-top characterization parameter

3.6

°C/W

Junction-to-board characterization parameter

70.4

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W