DAC5311, DAC6311, DAC7311

SBAS442C – AUGUST 2008 – REVISED JULY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

+6

V

Voltage

Digital input voltage to GND

–0.3

V

–0.3

V

150

°C

Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating temperature

–40

125

°C

Supply voltage

2

5.5

V

7.4 Thermal Information

DACx311

DCK (SC70)

UNIT

6 PINS

Junction-to-ambient thermal resistance

216.4

°C/W

Junction-to-case (top) thermal resistance

52.1

°C/W

Junction-to-board thermal resistance

65.9

°C/W

Junction-to-top characterization parameter

1.3

°C/W

Junction-to-board characterization parameter

65.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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