D10

10. It is recommended to specify an eccentricity between external edge (107.95) center and key (R1.57) center on the

recommended module board to 0.1 maximum.

11. Insert the module board in parallel to the connector opening. If a strong resistance is perceived, re-insert the board. Note: the

forced insertion could cause failure in the products.

12. If the connector is mounted horizontal to the direction, it is recommended to turn up the side to install the module board.

13. When two or more boards are arranged for use, it is recommended to specify the mounting pitch to 10.16mm or more. If the

less than 10.16mm pitch is used, confirm individual conditions.

14. The dip portion tip is considered for safety, the tip is slimmed for enhancement of mountability. Be careful for handling dip

portions.

15. Check the matching with individual module board, and confirm no problem.

16. The mounting height will increase under conditions of flow solder, board warpage, etc. Referring to the described values, check

and use this product according to actual equipment.

17. Since this product does not correspond to reflow, check individual conditions for application.

18. Since this product is not specified for active cable insertion and extraction, be sure to insert or extract the memory module in the

condition where unit power is turned off.

19. When the module board is engaged, check that the both board edges hook in the latch claws on the both sides, while left and

right convex portions of the connector are firmly inserted in the round holes of module on both sides. Inadequate engagement

(engagement as not described precedingly) could cause fuming, breakage, damage or contact failure in products. Take

particular care for the insertion.

20. In order to install the module board, avoid the insertion to hold and rotate either board end only. For the board won't hook in the

latches on the both side, or excessive force is applied to the connector or module board, which could cause failure or breakage

of the product. Push the upper sides at both board edges at a time, and rotate the board so as to uniformly apply force to the

latches.

21. If the memory module is not engaged in the board and exposed, dust will adhere to the opening area, which could cause

malfunction, contact failure or damage to the product. Before the memory module engagement, be sure to thoroughly remove

dusts on the connector.

22. Insert the module board along the guide (about 30 to 40°). If the module board is forcibly inserted in different directions, any

trouble could occur.

23. For module board installation, if board corners hit the connector, the product could be deformed or damaged.

24. If this product is used for personal computers, peripheral equipment (printer, etc.), check individual conditions.