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IS61DDPB22M18B Datasheet(PDF) 3 Page - Integrated Silicon Solution, Inc

Part # IS61DDPB22M18B
Description  1Mx36 and 2Mx18 configuration available
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Manufacturer  ISSI [Integrated Silicon Solution, Inc]
Direct Link  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS61DDPB22M18B Datasheet(HTML) 3 Page - Integrated Silicon Solution, Inc

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IS61DDPB22M18B/B1/B2
IS61DDPB21M36B/B1/B2
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
9/10/2014
3
Ball Descriptions
Symbol
Type
Description
K, K#
Input
Input clock: This input clock pair registers address and control inputs on the rising edge of K, and
registers data on the rising edge of K and the rising edge of K#. K# is ideally 180 degrees out of
phase with K. All synchronous inputs must meet setup and hold times around the clock rising edges.
These balls cannot remain VREF level.
CQ, CQ#
Output
Synchronous echo clock outputs: The edges of these outputs are tightly matched to the synchronous
data outputs and can be used as a data valid indication. These signals are free running clocks and
do not stop when Q tri-states.
Doff#
Input
DLL disable and reset input : when low, this input causes the DLL to be bypassed and reset the
previous DLL information. When high, DLL will start operating and lock the frequency after tCK lock
time. The device behaves in one read latency mode when the DLL is turned off. In this mode, the
device can be operated at a frequency of up to 167 MHz.
QVLD
Output
Valid output indicator: The Q Valid indicates valid output data. QVLD is edge aligned with CQ and
CQ#.
SA
Input
Synchronous address inputs: These inputs are registered and must meet the setup and hold times
around the rising edge of K. These inputs are ignored when device is deselected.
DQ0 - DQn
Bidir
Data input and output signals. Input data must meet setup and hold times around the rising edges of
K and K# during WRITE operations. These pins drive out the requested data when the read
operation is active. Valid output data is synchronized to the respective CQ and CQ#.
See BALL CONFIGURATION figures for ball site location of individual signals.
The x18 device uses DQ0~DQ17. DQ18~DQ35 should be treated as NC pin.
The x36 device uses DQ0~DQ35.
R/W#
Input
Synchronous Read or Write input. When LD# is low, this input designates the access type (read
when it is High, write when it is Low) for loaded address. R/W# must meet the setup and hold times
around edge of K.
LD#
Input
Synchronous load. This input is brought Low when a bus cycle sequence is defined. This definition
includes address and read/write direction.
BWx#
Input
Synchronous byte writes: When low, these inputs cause their respective byte to be registered and
written during WRITE cycles. These signals are sampled on the same edge as the corresponding
data and must meet setup and hold times around the rising edges of K and #K for each of the two
rising edges comprising the WRITE cycle. See Write Truth Table for signal to data relationship.
VREF
Input
reference
HSTL input reference voltage: Nominally VDDQ/2, but may be adjusted to improve system noise
margin. Provides a reference voltage for the HSTL input buffers.
VDD
Power
Power supply: 1.8 V nominal. See DC Characteristics and Operating Conditions for range.
VDDQ
Power
Power supply: Isolated output buffer supply. Nominally 1.5 V. See DC Characteristics and Operating
Conditions for range.
VSS
Ground
Ground of the device
ZQ
Input
Output impedance matching input: This input is used to tune the device outputs to the system data
bus impedance. Q and CQ output impedance are set to 0.2xRQ, where RQ is a resistor from this ball
to ground. This ball can be connected directly to VDDQ, which enables the minimum impedance
mode. This ball cannot be connected directly to VSS or left unconnected.
In ODT (On Die Termination) enable devices, the ODT termination values tracks the value of RQ.
The ODT range is selected by ODT control input.
TMS, TDI, TCK
Input
IEEE 1149.1 input pins for JTAG
TDO
Output
IEEE 1149.1 output pins for JTAG
NC
N/A
No connect: These signals should be left floating or connected to ground to improve package heat
dissipation.
ODT
Input
ODT control; Refer to SRAM features for the details.


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