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DRV5033AJEDBZTQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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DRV5033AJEDBZTQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page 4 DRV5033-Q1 SLIS164C – DECEMBER 2014 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: DRV5033-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Ensured by design. Only tested to –20 V. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Power supply voltage VCC –22(2) 40 V Voltage ramp rate (VCC), VCC < 5 V Unlimited V/µs Voltage ramp rate (VCC), VCC > 5 V 0 2 Output pin voltage –0.5 40 V Output pin reverse current during reverse supply condition 0 100 mA Magnetic flux density, BMAX Unlimited Operating junction temperature, TJ Q, see Figure 23 –40 150 °C E, see Figure 23 –40 17 Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V Charged-device model (CDM), per AEC Q100-011 ±500 (1) Power dissipation and thermal limits must be observed 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Power supply voltage 2.7 38 V VO Output pin voltage (OUT) 0 38 V ISINK Output pin current sink (OUT)(1) 0 30 mA TA Operating ambient temperature Q, see Figure 23 –40 125 °C E, see Figure 23 –40 150 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) DRV5033-Q1 UNIT DBZ (SOT-23) LPG (TO-92) 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 333.2 180 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.9 98.6 °C/W RθJB Junction-to-board thermal resistance 66.9 154.9 °C/W ψJT Junction-to-top characterization parameter 4.9 40 °C/W ψJB Junction-to-board characterization parameter 65.2 154.9 °C/W |
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