8

BRecommended Temperature Profile

HRS test conditions

Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

Environment

:Room air

Solder composition

:Paste, 63%Sn/37%Pb

(Senju Metal Industry, Co., Ltd.’s

Part Number: OZ63-201C-50-9)

Test board

:Glass epoxy 45mm∞100mm∞1.6mm thick

Land dimensions

:Lead type 0.3mm∞1.25mm,

0.3mm∞0.7mm

Leadless type 0.3mm∞1.25mm,

0.3mm∞0.65mm

Metal mask

:Lead type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.7mm∞0.1mm thick

Leadless type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.65mm∞0.1mm thick

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

HRS test condition

Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

Environment

:Room air

Solder composition

:Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.’s

Part Number: M705-221CM5-42-10.5)

Test board

:Glass epoxy 45mm∞100mm∞1.6mm thick

Land dimensions

: Lead type 0.3mm∞1.25mm,

0.3mm∞0.7mm

Leadless type 0.3mm∞1.25mm,

0.3mm∞0.65mm

Metal mask

: Lead type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.7mm∞0.1mm thick

Leadless type

0.25mm∞1.25mm∞0.1mm thick

0.25mm∞0.65mm∞0.1mm thick

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult tour solder paste and equipment

manufacturer for specific recommendations.

Start

(ç)

Time (Seconds)

60

25ç(60 sec.)

(20 sec.

to 30 sec.)

(30 sec.)

60 sec. to 90 sec.

Preheating

Soldering

0

50

100

150

150ç

160ç

240ç

200ç

5 sec. Max.

200

250

120

Max. 250ç

Start

Time (Seconds)

60

25ç (60 sec.)

(60 sec.)

90 sec. to 120 sec.

Preheating

Soldering

0

50

100

150

150ç

200ç

230ç

200

250

120

(ç)