A234

Note: Please Note that the above stacking tolerance doesn't include the solder paste thickness.

Before removing joint bar

After removing joint bar

Applicable Conditions

Reflow system

:IR reflow

Solder

:Paste type 63 Sn/37 Pb

(Flux content 11 wt%)

Test board

:Glass epoxy 161mm x 100mm x 1.6 mm

Metal mask thickness

:0.15 mm

Recommended temperature profile.

The temperature may be slightly changed according to the solder

paste type and amount.

Stack 3mm

3

mm

+0.3

_0.2

+0.3

_0.2

Stack 4mm

4

mm

BConnector Precautions for use

1. Tolerance Clearance on Mating Side

The effective contact length of the product is set to 0.7mm. Please use the product so as to set the clearance to less than

0.2mm between the header and the receptacle in the mating process.

2. Fixation between Mounting Boards

The very low profile and compact product, so never fix the connector between boards by mating force only

3. Stacking Height Tolerance for Mating

4. Handling two-piece connection Product

Both joint bars of the two-piece connection product are fixed by the joint members, but the mating cannot be implemented in

that state. Before mating, remove the joint bars as if pull it up. (Don't remove the joint members, before mounting on the

board.)

5. Mounting Temperature Profile (Reference)