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FH26-71S-0.3SHW Datasheet(PDF) 7 Page - Hirose Electric

Part # FH26-71S-0.3SHW
Description  0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors
Download  16 Pages
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Manufacturer  HIROSE [Hirose Electric]
Direct Link  http://www.hirose-connectors.com
Logo HIROSE - Hirose Electric

FH26-71S-0.3SHW Datasheet(HTML) 7 Page - Hirose Electric

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7
BRecommended Temperature Profile
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.'s
Part Number: SENSBY NR-2)
Environment:
:Room air
Solder composition:
:Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.'s
Part Number: OZ63-201C-50-9)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions
:0.3mm∞0.65mm,0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may
vary,depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.'s
Part Number: SENSBY NR-NR-2)
Environment
:Room air
Solder composition
:Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number: M705-221CM5-42-10.5)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions
:0.3mm∞0.65mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Start
（℃）
Time (Seconds)
60
25℃
（60sec.）
20 sec. to
30 sec.
（30sec.）
60 sec. to 90 sec.
Preheating
Soldering
0
50
100
150
150℃
160℃
240℃
200℃
5 sec. max.
200
250
120
qUsing Typical Solder Paste
MAX 250℃
Start
（℃）
Time (Seconds)
60
25℃
（60sec.）
（60sec.）
90 sec. to 120 sec.
Preheating
Soldering
0
50
100
150
150℃
200℃
230℃
200
250
120
qUsing Lead-free Solder Paste


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