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FH25-21S-0.3SH Datasheet(PDF) 1 Page - Hirose Electric

Part No. FH25-21S-0.3SH
Description  0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.
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Maker  HIROSE [Hirose Electric]
Homepage  http://www.hirose-connectors.com
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FH25-21S-0.3SH Datasheet(HTML) 1 Page - Hirose Electric

   
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1
0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.
FH 25 Series
NEW
NEW
2004.6
sFeatures
1. Extremely light weight
The largest version, with all contacts loaded, weights
only 0.11gramms.
2. Conductive traces on the PCB can run
under the connector
No exposed contacts on the bottom of the connector.
3. High density together with reliable solderability on the board
Staggered contact points and the leads plus the nickel
barriers assure sufficient distance to prevents solder
bridging.
4. Easy FPC insertion and reliable electrical connection
Proven Flip Lock® actuator allows easy insertion of FPC.
Tactile sensation when fully closed confirms complete
electrical and mechanical connection.
5. Accepts standard thickness FPC
0.2 mm thick standard Flexible Printed Circuit board can
be used. This is the only ultra-low profile ZIF connector
allowing the use of standard FPC.
6. Board placement with automatic equipment
Flat top surface and packaging on the tape-and-reel
allows use of vacuum nozzles.
Standard reel contains 5,000 connectors.
sApplications
Mobile phones, PDA’s, digital cameras, digital video
cameras, LCD connections, plasma displays (PDP), camera
modules and other compact devices requiring Flexible
Printed Circuit connections using high reliability ultra-small
profile connectors.
3.45mm
17.1mm
(51pos. type)
0.3mm
Solid bottom surface
0.6mm
Insulator body
Contacts
Mounting pitch
Nickel barrier prevents
solder bridges
Actuator open
FPC insertion direction
Actuator closed
FPC fully inserted
No exposed contacts
Metal fittings do not protrude outside of the connector body
Absence of protrusions on each
side of connector allows closer
side-by-side mounting of the
connectors or closer component
placement in miniaturized devices.
FPC


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