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AM3871CCYE100 Datasheet(PDF) 5 Page - Texas Instruments |
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AM3871CCYE100 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 358 page  AM3874, AM3871 www.ti.com SPRS695D – SEPTEMBER 2011 – REVISED JANUARY 2016 Table of Contents 1 High-Performance System-on-Chip (SoC) .......... 1 8.5 Interrupts ........................................... 201 1.1 Features .............................................. 1 9 Peripheral Information and Timings .............. 204 1.2 Applications ........................................... 2 9.1 Parameter Information ............................. 204 9.2 Recommended Clock and Control Signal Transition 1.3 Description ............................................ 3 Behavior ............................................ 205 1.4 Functional Block Diagram ............................ 4 9.3 Controller Area Network Interface (DCAN) ........ 206 2 Revision History ......................................... 6 9.4 EDMA .............................................. 208 3 Device Overview ......................................... 7 9.5 Emulation Features and Capability ................ 215 3.1 Device Comparison ................................... 7 9.6 Ethernet MAC Switch (EMAC SW) ................ 219 3.2 Device Characteristics ................................ 7 9.7 General-Purpose Input/Output (GPIO) ............. 234 3.3 Device Compatibility .................................. 9 9.8 General-Purpose Memory Controller (GPMC) and 3.4 ARM Cortex-A8 Microprocessor Unit (MPU) Error Location Module (ELM) ...................... 237 Subsystem Overview ................................. 9 9.9 High-Definition Multimedia Interface (HDMI) ...... 254 3.5 Media Controller Overview .......................... 11 9.10 High-Definition Video Processing Subsystem 3.6 SGX530 Overview .................................. 12 (HDVPSS) .......................................... 257 3.7 Spinlock Module Overview .......................... 12 9.11 Inter-Integrated Circuit (I2C) ....................... 263 3.8 Mailbox Module Overview ........................... 13 9.12 Imaging Subsystem (ISS) .......................... 267 3.9 Memory Map Summary ............................. 14 9.13 DDR2/DDR3 Memory Controller ................... 270 4 Device Pins .............................................. 21 9.14 Multichannel Audio Serial Port (McASP) .......... 305 4.1 Pin Maps ............................................ 21 9.15 Multichannel Buffered Serial Port (McBSP) ........ 313 4.2 Terminal Functions .................................. 30 9.16 MultiMedia Card/Secure Digital/Secure Digital Input 5 Device Configurations ............................... 140 Output (MMC/SD/SDIO) ........................... 318 5.1 Control Module Registers .......................... 140 9.17 Peripheral Component Interconnect Express (PCIe) .............................................. 321 5.2 Boot Modes ........................................ 140 9.18 Serial ATA Controller (SATA) ...................... 328 5.3 Pin Multiplexing Control ............................ 146 9.19 Serial Peripheral Interface (SPI) ................... 332 5.4 Handling Unused Pins ............................. 157 9.20 Timers .............................................. 339 5.5 DeBugging Considerations ........................ 157 9.21 Universal Asynchronous Receiver/Transmitter 6 System Interconnect ................................. 159 (UART) ............................................. 341 7 Device Operating Conditions ....................... 163 9.22 Universal Serial Bus (USB2.0) ..................... 343 7.1 Absolute Maximum Ratings ....................... 163 10 Device and Documentation Support .............. 351 7.2 Recommended Operating Conditions ............. 164 10.1 Device Support ..................................... 351 7.3 Power-On Hours (POH) ........................... 165 10.2 Documentation Support ............................ 352 7.4 Electrical Characteristics Over Recommended 10.3 Related Links ...................................... 352 Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted) ........... 166 10.4 Community Resources ............................. 352 7.5 Thermal Resistance Characteristics (PBGA 10.5 Trademarks ........................................ 353 Package) [CYE-04] (Thinner Top Hat) ............. 167 10.6 Electrostatic Discharge Caution ................... 353 8 Power, Reset, Clocking, and Interrupts .......... 168 10.7 Export Control Notice .............................. 353 8.1 Power, Reset and Clock Management (PRCM) 10.8 Glossary ............................................ 353 Module ............................................. 168 11 Mechanical, Packaging, and Orderable 8.2 Power .............................................. 168 Information ............................................. 354 8.3 Reset ............................................... 176 11.1 Packaging Information ............................. 354 8.4 Clocking ............................................ 184 Copyright © 2011–2016, Texas Instruments Incorporated Table of Contents 5 Submit Documentation Feedback Product Folder Links: AM3874 AM3871 |
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