72

B

Recommended Temperature Profile

HRS test conditions

Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

Environment

:Room air

Solder composition

:Paste, 63%Sn/37%Pb

(Senju Metal Industry, Co., Ltd.’s

Part Number: OZ63-201C-50-9)

Test board

:Glass epoxy 45mm∞80mm∞1.6mm thick

Land dimensions

:Contact Pitch 0.3mm, 0.4mm

0.3mm∞1.7mm

Contact Pitch 0.5mm

0.6mm∞1.7mm

Metal mask

:Contact Pitch 0.3mm, 0.4mm

0.25mm∞1.7mm∞0.15mm thick

Contact Pitch 0.5mm

0.5mm∞1.7mm∞0.15mm thick

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

5 sec. max.

240ç

200ç

160ç

150ç

25ç

(30 sec.)

60

120

180

(20 to 30 sec.)

Soldering

250

200

150

100

50

0

Start

Time (sec.)

(60 sec.)

60 to 90 sec.

Preheating