7

BUsage Precautions

Note 1: Up to 2 cycles are possible under the same conditions provided that there is a return to normal

temperature between the first and second cycle.

Note 2: This temperature profile indicates the temperature of the connector terminal lead at the point of contact

with the PCB.

1.Recommended

Temperature Profile

Temperature

2.Recommended Manual

Soldering Conditions

4.Board Warping

sWhen manually handling the connectors avoid touching any portion of exposed terminal leads.

When mating/un-mating do not use excessive force or lifting of one side only.

5.Cleaning Conditions

6.Use and handling precautions.

3.Recommended Screen

Thickness and Open Area

Ratio (Pattern Area Ratio)

Temperature: 290

ç±10ç, Soldering time: within 2 sec.

sIR only, or with the addition of hot air (at the recommended temperature profile)

sTogether with the N2 gas

(Maximum temperature -20ç): 30 sec. max.

Thickness

Maximum Temperature (5 sec. max.)

0.12mm

220

ç

100%

100%

230

ç

100%

240

ç

250

ç

0.15mm

Open Area Ratio

0ç

50ç

100ç

150ç

150

ç 30 sec. to 90 sec.

235±5ç 10 sec. max.

220

çmin.10 sec. to 20 sec.

200ç

250ç

Temperature

50 s

Preheating

IR Reflow

Preheating :

Soldering :

Soldering

0 s

90 s

150 s

Time

Maximum. 240ç

220ç