7

BUsage recommendation

Temperature

IR Reflow

Preheating: 150°C for 60 sec. to 120 sec.

Soldering: 235°C±5°C for 10 sec. max.

... Maximum 240°C 220°C min.

10s to 30s ... 220°C

Preheating

Soldering

Maximum 240°C

220°C

1. Recommended Soldering

Temperature Profile for IR Reflow.

2.Recommended Manual Soldering Conditions

3. Recommended Solder Screen Thickness

4. Board Warping

5. Cleaning Conditions

6. Wiring Termination Conditions

7. Mating / un-mating precautions

Soldering temperature: 290°C ±10°C, Soldering time: within 3 sec.

0.15mm

Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.

Refer to "Nylon Connector Use Handbook."

Refer to "Nylon Connector Use Handbook."

Crimp contacts should be handled with care as not to cause any deformation or damage

affecting the performance or termination.

Excessive twisting and pulling on wires during mating/un-mating should be avoided as it

may cause damage to connectors.

Note 1: Up to 2 cycles of reflow soldering are possible under the same conditions, provided

that there is a return to normal temperature between the first and second cycle.

Note 2: The temperature indicates the board surface temperature at the points of contacts

with the connector terminals.