250ç

200ç

150ç

100ç

50ç

0ç

0SSEC

50SSEC

100SSEC

150SSEC

200SSEC

Time

Soldering area

Preheating area

Max 240ç

220ç

Temperature

Preheating area

IR reflow condition

150ç

30 to 90 seconds

235ç±5ç

220ç min.

10 seconds max.

10 to 20 seconds

Soldering area

A318

1. Recommended Temperature Profile (SMT)

2. Recommended Manual Soldering Condition (SMT)

3. Recommended Screen Thickness (SMT)

4. Board Warp (SMT)

5. Cleaning Condition

6. Cautions

Note1: Maximun twice actions are allowed under the same condition. However, the interval

between the first and second actions must be maintained at the room temperature.

Note2: The temperature indicates the board surface temperature of the connector lead area.

Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds

0.15mm

Maximum 0.2mm in the connector center area, based on the both connector edges

Refer to the "Nylon Connector Use Hand book".

sThe header is designed in a structure where contacts are exposed. Touching it with bare hands

would cause contact failure or electrostatic element damage.

sWhere no board is mounted, the insertion or extraction will cause damage or contact deformation.

sAvoid retaining the board with the connector only, and fix the board by any other means than the connector.

sExcessive scoop insertion or extraction may result in damage.

sIn the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.

sThe color phase of this product may be slightly different from that of the formed product

according to the manufacturing lot. However, the difference doesn't affect the performance.

BPrecautions