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LM3642TLX-LT Datasheet(PDF) 4 Page - Texas Instruments |
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LM3642TLX-LT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page LM3642 SNVS891H – SEPTEMBER 2012 – REVISED SEPTEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT VIN, VSW,VOUT –0.3 6 V VSCL, VSDA, VSTROBE, VTX, VLED the lesser of (VIN+0.3) w/ –0.3 Vmax V Continuous power dissipation(4) Internally limited Junction temperature (TJ-MAX) 150 °C Maximum lead temperature (soldering) See(5) Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typical) and disengages at TJ = 135°C (typical). Thermal shutdown is verified by design. (5) For detailed soldering specifications and information, refer to Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package (SNVA009). 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN 2.5 5.5 V Junction temperature (TJ) –40 125 °C Ambient temperature (TA) (2) –40 85 °C (1) All voltages are with respect to the potential at the GND pin. (2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 6.4 Thermal Information LM3642 THERMAL METRIC(1) YZR (DSBGA) UNIT 9 PINS RθJA Junction-to-ambient thermal resistance 100.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.7 °C/W RθJB Junction-to-board thermal resistance 16.4 °C/W ψJT Junction-to-top characterization parameter 3.2 °C/W ψJB Junction-to-board characterization parameter 16.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: LM3642 |
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