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XM1003-BD-EV1 Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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XM1003-BD-EV1 Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 9 page Image Reject Mixer 32.0-42.0 GHz Rev. V1 XM1003-BD 1 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 1 Features Sub-harmonic Image Reject Mixer GaAs HBT Technology 9.0 dB Conversion Loss 18.0 dB Image Rejection 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010 RoHS* Compliant and 260°C Reflow Compatible Description M/A-COM Tech’s 32.0-42.0 GHz GaAs MMIC sub- harmonic image reject mixer can be used as an up- or down-converter. The device has a conversion loss of 9.0 dB with 18.0 dB image rejection across the band. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses M/A-COM Tech’s GaAs HBT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications. Ordering Information Part Number Package XM1003-BD-000V “V” - vacuum release gel paks XM1003-BD-EV1 evaluation module Absolute Maximum Ratings Parameter Absolute Max. Input Power (RF Pin) +20.0 dBm Input Power (IF Pin) +20.0 dBm Storage Temperature (Tstg) -65 °C to +165 °C Operating Temperature (Ta) -55 °C to +125 °C Chip Device Layout |
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