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XM1003-BD-EV1 Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

Part # XM1003-BD-EV1
Description  Sub-harmonic Image Reject Mixer
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

XM1003-BD-EV1 Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc.

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Image Reject Mixer
32.0-42.0 GHz
Rev. V1
XM1003-BD
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1
Features
 Sub-harmonic Image Reject Mixer
 GaAs HBT Technology
 9.0 dB Conversion Loss
 18.0 dB Image Rejection
 100% On-Wafer RF Testing
 100% Visual Inspection to MIL-STD-883 Method
2010
 RoHS* Compliant and 260°C Reflow Compatible
Description
M/A-COM Tech’s 32.0-42.0 GHz GaAs MMIC sub-
harmonic image reject mixer can be used as an up-
or down-converter. The device has a conversion
loss of 9.0 dB with 18.0 dB image rejection across
the band. I and Q mixer outputs are provided and an
external 90 degree hybrid is required to select the
desired sideband. This MMIC uses M/A-COM Tech’s
GaAs HBT device model technology, and is based
upon electron beam lithography to ensure high
repeatability and uniformity. The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow
either a conductive epoxy or eutectic solder die
attach process. This device is well suited for
Millimeter-wave
Point-to-Point
Radio,
LMDS,
SATCOM and VSAT applications.
Ordering Information
Part Number
Package
XM1003-BD-000V
“V” - vacuum release
gel paks
XM1003-BD-EV1
evaluation module
Absolute Maximum Ratings
Parameter
Absolute Max.
Input Power (RF Pin)
+20.0 dBm
Input Power (IF Pin)
+20.0 dBm
Storage Temperature (Tstg)
-65 °C to +165 °C
Operating Temperature (Ta)
-55 °C to +125 °C
Chip Device Layout


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