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XL1000-BD-EV1 Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

Part # XL1000-BD-EV1
Description  Low Noise Amplifier
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

XL1000-BD-EV1 Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc.

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Low Noise Amplifier
20.0-40.0 GHz
Rev. V1
XL1000-BD
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1
Features
 Self Bias Architecture
 Small Size
 3.0 or 5.0 V Operation
 20.0 dB Small Signal Gain
 2.0 dB Noise Figure
 +9.0 dBm P1dB Compression Point
 100% On-Wafer RF, DC and Noise Figure
Testing
 100% Visual Inspection to MIL-STD-883 Method
2010
 RoHS* Compliant and 260°C Reflow Compatible
Description
M/A-COM Tech’s three stage 20.0-40.0 GHz GaAs
MMIC low noise amplifier has a small signal gain of
20.0 dB with a noise figure of 2.0 dB across the
band. This MMIC uses M/A-COM Tech’s GaAs
PHEMT device model technology, and is based
upon electron beam lithography to ensure high
repeatability and uniformity. The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow
either a conductive epoxy or eutectic solder die
attach process. This device is well suited for
Millimeter-wave
Point-to-Point
Radio,
LMDS,
SATCOM and VSAT applications.
Ordering Information
Part Number
Package
XL1000-BD-000V
“V” - vacuum release
gel paks
XL1000-BD-EV1
evaluation module
Absolute Maximum Ratings
Parameter
Absolute Max.
Supply Voltage (Vd)
+7.0 VDC
Supply Current (Id)
70 mA
Input Power (Pin)
+12 dBm
Storage Temperature (Tstg)
-65 °C to +165 °C
Operating Temperature (Ta)
-55 °C to +85 °C
Channel Temperature (Tch)1
+175 °C
1. Channel temperature directly affects a device's MTTF. Chan-
nel temperature should be kept as low as possible to maximize
lifetime.
Chip Device Layout


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