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MADP-000907-14020 Datasheet(PDF) 5 Page - M/A-COM Technology Solutions, Inc.

Part No. MADP-000907-14020
Description  Solderable AlGaAs Flip Chip PIN
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Maker  MA-COM [M/A-COM Technology Solutions, Inc.]
Homepage  http://www.macomtech.com

MADP-000907-14020 Datasheet(HTML) 5 Page - M/A-COM Technology Solutions, Inc.

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Solderable AlGaAs Flip Chip PIN
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
Device Installation Guidelines
This device should be handled in a clean environment. The chip is resistant to solvents and may be cleaned
using approved industry standard practices and chemicals.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD
handling techniques should be used. These devices are rated Class 0, (0-199V) HBM per MIL-STD-883, method
3015.7 and should be handled in a static-free environment.
General Handling
The die has a BCB, polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy
The MADP-000907-14020 is designed to be inserted onto hard or soft substrates with the junction/pad side
down. It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately
1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure
times, > 30 minutes, temperatures must be kept below 200°C.
Eutectic Solder Die Attached
63/37 Sn/Pb or any RoHS compliant solder may be used for diode attachment. It is recommended that the
attachment surface be preheated to 100°C prior to re-flow in order to minimize CTE mismatches. Gradual
temperature ramp up and ramp down is also recommended with a maximum soldering temperature of 280°C for
less than 10 seconds. See Application Note M538 for recommended soldering profile.
(2) PL
(2) PL
Circuit Pad Layout
Part Number
Waffle Pack
Tape and Reel
Ordering Information

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