Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

MADP-000907-14020 Datasheet(PDF) 5 Page - M/A-COM Technology Solutions, Inc.

Part No. MADP-000907-14020
Description  Solderable AlGaAs Flip Chip PIN
Download  6 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  MA-COM [M/A-COM Technology Solutions, Inc.]
Homepage  http://www.macomtech.com
Logo 

MADP-000907-14020 Datasheet(HTML) 5 Page - M/A-COM Technology Solutions, Inc.

   
Zoom Inzoom in Zoom Outzoom out
 5 / 6 page
background image
Solderable AlGaAs Flip Chip PIN
V3
MADP-000907-14020
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
Device Installation Guidelines
Cleanliness
This device should be handled in a clean environment. The chip is resistant to solvents and may be cleaned
using approved industry standard practices and chemicals.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD
handling techniques should be used. These devices are rated Class 0, (0-199V) HBM per MIL-STD-883, method
3015.7 and should be handled in a static-free environment.
General Handling
The die has a BCB, polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy
The MADP-000907-14020 is designed to be inserted onto hard or soft substrates with the junction/pad side
down. It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately
1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure
times, > 30 minutes, temperatures must be kept below 200°C.
Eutectic Solder Die Attached
63/37 Sn/Pb or any RoHS compliant solder may be used for diode attachment. It is recommended that the
attachment surface be preheated to 100°C prior to re-flow in order to minimize CTE mismatches. Gradual
temperature ramp up and ramp down is also recommended with a maximum soldering temperature of 280°C for
less than 10 seconds. See Application Note M538 for recommended soldering profile.
0.012”
(2) PL
0.008”
(2) PL
0.013”
Circuit Pad Layout
Part Number
Packaging
MADP-000907-14020W
Waffle Pack
MADP-000907-14020P
Tape and Reel
Ordering Information


Html Pages

1  2  3  4  5  6 


Datasheet Download




Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn