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PI6C4911505-07 Datasheet(PDF) 11 Page - Pericom Semiconductor Corporation |
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PI6C4911505-07 Datasheet(HTML) 11 Page - Pericom Semiconductor Corporation |
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11 / 12 page  11 www.pericom.com PI6C4911505-07 Rev C 01/26/16 PI6C4911505-07 High Performance 1:5 LVPECL Fanout Buffer 3) Chassis air flow and cooling mechanism. More air flow M/s and adding heat sink on device can reduce device final die junc- tion temperature Tj The individual device thermal calculation formula: Tj =Ta + Pchip x Ja Tc = Tj - Pchip x Jc Ja ___ Package thermal resistance from die to the ambient air in C/W unit; This data is provided in JEDEC model simulation. An air flow of 1m/s will reduce Ja (still air) by 20~30% Jc ___ Package thermal resistance from die to the package case in C/W unit Tj ___ Die junction temperature in C (industry limit <125C max.) Ta ___ Ambiant air température in C Tc ___ Package case temperature in C Pchip___ IC actually consumes power through Iee/GND cur- rent Thermal Information Symbol Description Condition Q JA Junction-to-ambient thermal resistance Still air 84.0 OC/W Q JC Junction-to-case thermal resistance 17.0 OC/W Thermal calculation example To calculate Tj and Tc of PI6CV304 in an SOIC-8 package: Step 1: Go to Pericom web to find Ja=157 C/W, Jc=42 C/W http://www.pericom.com/support/packaging/packaging-me- chanicals-and-thermal-characteristics/ Step 2: Go to device datasheet to find Idd=40mA max. Step 3: P_total= 3.3Vx40mA=0.132W Step 4: If Ta=85C Tj= 85 + Ja xP_total= 85+25.9 = 105.7C Tc= Tj + Jc xP_total= 105.7- 5.54 = 100.1C Note: The above calculation is directly using Idd current without sub- tracting the load power, so it is a conservative estimation. For more precise thermal calculation, use P_unload or P_chip from device Iee or GND current to calculate Tj, especially for LVPECL buffer ICs that have a 150ohm pull-down and equivalent 100ohm differential RX load. 16-0016 |
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