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CSD17308Q3T Datasheet(PDF) 1 Page - Texas Instruments |
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CSD17308Q3T Datasheet(HTML) 1 Page - Texas Instruments |
1 / 13 page VGS - Gate-to-Source Voltage (V) 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 D007 Qg - Gate Charge (nC) 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 D004 ID = 10 A VDS = 15 V D D D D D 5 G 6 S 7 S 8 S P0095-01 Product Folder Sample & Buy Technical Documents Tools & Software Support & Community Reference Design CSD17308Q3 SLPS262B – FEBRUARY 2010 – REVISED OCTOBER 2015 CSD17308Q3 30-V N-Channel NexFET™ Power MOSFETs 1 Features Product Summary 1 • Optimized for 5-V Gate Drive TA = 25°C VALUE UNIT • Ultra-Low Qg and Qgd VDS Drain-to-source voltage 30 V • Low Thermal Resistance Qg Gate charge total (4.5 V) 3.9 nC Qgd Gate charge gate to drain 0.8 nC • Avalanche Rated VGS = 3 V 12.5 m Ω • Pb Free Terminal Plating RDS(on) Drain-to-source on resistance VGS = 4.5 V 9.4 m Ω • RoHS Compliant VGS = 8 V 8.2 m Ω • Halogen Free VGS(th) Threshold voltage 1.3 V • VSON 3.3 mm × 3.3 mm Plastic Package Ordering Information(1) 2 Applications DEVICE QTY MEDIA PACKAGE SHIP • Notebook Point of Load 13-Inch SON 3.3 mm × 3.3 mm Tape and CSD17308Q3 2500 Reel Plastic Package Reel • Point-of-Load Synchronous Buck in Networking, (1) For all available packages, see the orderable addendum at Telecom, and Computing Systems the end of the data sheet. 3 Description Absolute Maximum Ratings This 30-V, 8.2-m Ω, 3.3 mm × 3.3 mm VSON TA = 25°C unless otherwise stated VALUE UNIT NexFET™ power MOSFET is designed to minimize VDS Drain-to-source voltage 30 V losses in power conversion applications and VGS Gate-to-source voltage +10 / –8 V optimized for 5-V gate drive applications. Continuous Drain Current (Package 50 Limited) Top View ID A Continuous drain current, TC = 25°C 44 Continuous drain current(1) 14 IDM Pulsed drain current, TA = 25°C (2) 167 A Power dissipation(1) 2.7 PD W Power Dissipation, TC = 25°C 28 TJ, Operating Junction and Storage –55 to 150 °C Tstg Temperature Range Avalanche energy, single pulse EAS 65 mJ ID = 36 A, L = 0.1 mH, RG = 25 Ω (1) Typical RθJA = 46°C/W when mounted on a 1 inch 2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 0.06 inch (1.52 mm) thick FR4 PCB. (2) Max RθJC = 4.5°C/W, pulse duration ≤100 μs, duty cycle ≤1%. RDS(on) vs VGS Gate Charge 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
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