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HMC364G8 Datasheet(PDF) 5 Page - Hittite Microwave Corporation |
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HMC364G8 Datasheet(HTML) 5 Page - Hittite Microwave Corporation |
5 / 6 page MICROWAVE CORPORATION 10 - 36 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 10 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 13.0 GHz HMC364G8 Evaluation PCB List of Materials The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evalu- ation board is designed for single ended input testing. J2 and J3 provide differential output signals. v00.1002 Item Description J1 - J3 PC Mount SMA RF Connector C1 - C4 100 pF Capacitor, 0402 Pkg. C5 1000 pF Capacitor, 0603 Pkg. C6 10 uF Tantalum Capacitor U1 HMC364G8 Divide-by-2 PCB* 104627 Eval Board * Circuit Board Material: Rogers 4350 |
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