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SSM6K504NU Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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SSM6K504NU Datasheet(HTML) 1 Page - Toshiba Semiconductor |
1 / 9 page SSM6K504NU 1 MOSFETs Silicon N-Channel MOS (U-MOS-H) SSM6K504NU SSM6K504NU SSM6K504NU SSM6K504NU Start of commercial production 2012-07 1. 1. 1. 1. Applications Applications Applications Applications • High-Speed Switching 2. 2. 2. 2. Features Features Features Features (1) 4.5 V gate drive voltage. (2) Low drain-source on-resistance : RDS(ON) = 26 mΩ (max) (@VGS = 4.5 V) RDS(ON) = 19.5 mΩ (max) (@VGS = 10 V) 3. 3. 3. 3. Packaging and Pin Assignment Packaging and Pin Assignment Packaging and Pin Assignment Packaging and Pin Assignment UDFN6B 1.2.5.6 Drain 3. Gate 4. Source 4. 4. 4. 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T Absolute Maximum Ratings (Note) (Unless otherwise specified, T Absolute Maximum Ratings (Note) (Unless otherwise specified, T Absolute Maximum Ratings (Note) (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25 )))) Characteristics Drain-source voltage Gate-source voltage Drain current (DC) Drain current (pulsed) Power dissipation Power dissipation Channel temperature Storage temperature t ≤ 10 s (Note 1) (Note 1,2) (Note 3) (Note 3) Symbol VDSS VGSS ID IDP PD PD Tch Tstg Rating 30 ±20 9 18 1.25 2.5 150 -55 to 150 Unit V A W W Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Ensure that the channel temperature does not exceed 150. Note 2: Pulse width (PW) ≤ 10 ms, duty ≤ 1% Note 3: Device mounted on a FR4 board. (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad : 645 mm2) 2014-04-04 Rev.2.0 |
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