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SSM6K504NU Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # SSM6K504NU
Description  MOSFETs Silicon N-Channel MOS (U-MOS-H)
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM6K504NU Datasheet(HTML) 1 Page - Toshiba Semiconductor

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SSM6K504NU
1
MOSFETs Silicon N-Channel MOS (U-MOS-H)
SSM6K504NU
SSM6K504NU
SSM6K504NU
SSM6K504NU
Start of commercial production
2012-07
1.
1.
1.
1. Applications
Applications
Applications
Applications
High-Speed Switching
2.
2.
2.
2. Features
Features
Features
Features
(1)
4.5 V gate drive voltage.
(2)
Low drain-source on-resistance
: RDS(ON) = 26 mΩ (max) (@VGS = 4.5 V)
RDS(ON) = 19.5 mΩ (max) (@VGS = 10 V)
3.
3.
3.
3. Packaging and Pin Assignment
Packaging and Pin Assignment
Packaging and Pin Assignment
Packaging and Pin Assignment
UDFN6B
1.2.5.6 Drain
3. Gate
4. Source
4.
4.
4.
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25
))))
Characteristics
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (pulsed)
Power dissipation
Power dissipation
Channel temperature
Storage temperature
t ≤ 10 s
(Note 1)
(Note 1,2)
(Note 3)
(Note 3)
Symbol
VDSS
VGSS
ID
IDP
PD
PD
Tch
Tstg
Rating
30
±20
9
18
1.25
2.5
150
-55 to 150
Unit
V
A
W
W
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Pulse width (PW) ≤ 10 ms, duty ≤ 1%
Note 3: Device mounted on a FR4 board.
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad : 645 mm2)
2014-04-04
Rev.2.0


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