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HMC327MS8G Datasheet(PDF) 6 Page - Hittite Microwave Corporation

Part No. HMC327MS8G
Description  GaAs InGaP HBT MMIC POWER AMPLIFIER, 3.0 - 4.0 GHz
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Maker  HITTITE [Hittite Microwave Corporation]
Homepage  http://www.hittite.com
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HMC327MS8G Datasheet(HTML) 6 Page - Hittite Microwave Corporation

   
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MICROWAVE CORPORATION
8 - 109
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
8
HMC327MS8G
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 3.0 - 4.0 GHz
Evaluation PCB
The circuit board used in the final application should use RF
circuit design techniques. Signal lines should have 50 ohm
impedance while the package ground leads and exposed
paddle should be connected directly to the ground plane
similar to that shown. A sufficient number of VIA holes
should be used to connect the top and bottom ground
planes. The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board shown is
available from Hittite upon request.
List of Material
v02.1202
Item
Description
J1 - J2
PC Mount SMA RF Connector
J3
2 mm DC Header
C1 - C3
330 pF Capacitor, 0603 Pkg.
C4
1.2 pF Capacitor, 0603 Pkg.
C5
2.0 pF Capacitor, 0402 Pkg.
C6
2.2 µF Capacitor, Tantalum
L1
3.0 nH Inductor, 0805 Pkg.
R1
130 Ohm Resistor, 0603 Pkg.
U1
HMC327MS8G Amplifier
PCB*
104829 Eval Board
* Circuit Board Material: Rogers 4350


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