LP38513

SNVS361E – JULY 2007 – REVISED NOVEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

IN pin voltage (survival)

−0.3

6

V

EN pin voltage (survival)

−0.3

6

V

OUT pin Voltage (survival)

−0.3

6

V

ERROR pin voltage (survival)

−0.3

6

V

Internally limited

Internally limited

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

2.25

5.5

V

0

5.5

V

ERROR pin voltage

0

V

Output current (DC)

0

3

mA/A

−40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6.4 Thermal Information

LP38513

NDH (TO-220)

KTT (DDPAK/TO-263)

UNIT

5 PINS

5 PINS

Junction-to-ambient thermal resistance

31.9

32.9

°C/W

Junction-to-case (top) thermal resistance

43.7

37.6

°C/W

Junction-to-board thermal resistance

16.4

18.9

°C/W

Junction-to-top characterization parameter

8.3

5.7

°C/W

Junction-to-board characterization parameter

16.4

17.3

°C/W

Junction-to-case (bottom) thermal resistance

1.2

1.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2007–2015, Texas Instruments Incorporated

Product Folder Links: LP38513