LP2992

SNVS171I – NOVEMBER 2001 – REVISED NOVEMBER 2015

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Table of Contents

7.4

Device Functional Modes........................................ 14

1

Features .................................................................. 1

8

Application and Implementation ........................ 15

2

Applications ........................................................... 1

8.1

Application Information............................................ 15

3

Description ............................................................. 1

8.2

Typical Application ................................................. 15

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 21

5

Pin Configuration and Functions ......................... 3

10

Layout................................................................... 21

6

Specifications......................................................... 4

10.1

Layout Guidelines ................................................. 21

6.1

Absolute Maximum Ratings ...................................... 4

10.2

Layout Examples................................................... 21

6.2

ESD Ratings.............................................................. 4

10.3

WSON Mounting ................................................... 22

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 23

6.4

Thermal Information .................................................. 5

11.1

Documentation Support ........................................ 23

6.5

Electrical Characteristics........................................... 5

11.2

Community Resources.......................................... 23

6.6

Typical Characteristics .............................................. 7

11.3

Trademarks ........................................................... 23

7

Detailed Description ............................................ 13

11.4

Electrostatic Discharge Caution ............................ 23

7.1

Overview ................................................................. 13

11.5

Glossary ................................................................ 23

7.2

Functional Block Diagram ....................................... 13

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 13

Information ........................................................... 23

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (January 2015) to Revision I

Page

•

Added top navigator icon for TI Design ................................................................................................................................. 1

•

Changed "174.2°C/W" to "169.7°C/W" in footnote 3 to Abs Max table. ................................................................................ 4

•

Changed ESD Ratings table to differentiate different values for different pins/packages. .................................................... 4

•

Added new footnotes 2 and 3 to Thermal Information table; update thermal values for DBV (SOT-23) package. ............... 5

•

Added Power Dissipation and Estimating Junction Temperature subsections ................................................................... 18

•

Added additional related document links ............................................................................................................................. 23

Changes from Revision G (March 2013) to Revision H

Page

•

Added Device Information and ESD Ratings tables, Pin Configuration and Functions, Feature Description , Device

Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and

Documentation Support , and Mechanical, Packaging, and Orderable Information sections; update Thermal Values

and pin names ........................................................................................................................................................................ 1

Changes from Revision F (March 2013) to Revision G

Page

•

Changed Changed layout of National Data Sheet to TI format ............................................................................................. 1

2

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