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CDBV220-G Datasheet(PDF) 1 Page - Comchip Technology

Part # CDBV220-G
Description  SMD Schottky Barrier Diodes
Download  4 Pages
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Manufacturer  COMCHIP [Comchip Technology]
Direct Link  http://www.comchiptech.com
Logo COMCHIP - Comchip Technology

CDBV220-G Datasheet(HTML) 1 Page - Comchip Technology

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CDBV220-G
Forward current: 2.0A
Reverse voltage: 20V
RoHS Device
Features
- Low Forward Voltage Drop.
- Very Small SMD Package.
Mechanical Data
- Case: SOD-323, molded plastic.
- Terminals: Solderable per MIL-STD-750, method
2026.
- Polarity: Indicated by cathode end.
Dimensions in inches and (millimeter)
0.071 (1.80)
0.063 (1.60)
0.055 (1.40)
0.047 (1.20)
0.108 (2.75)
0.100 (2.55)
0.039 (1.00)
MAX.
0.014 (0.35)
0.010 (0.25)
0.019 (0.475)REF
0.006 (0.15)
0.004 (0.10)
SMD Schottky Barrier Diodes
0.003 (0.08)
Circuit Diagram
Parameter
Unit
Maximum Ratings (At Ta=25°C, unless otherwise noted)
Peak repetitive reverse voltage
Working peak reverse voltage
RMS reverse voltage
Continuous forward current
Non-repetitive peak forward surge current @ t=8.3ms
Power dissipation
Thermal resistance from junction to ambient
Junction temperature range
Symbol
VRRM
VRWM
VR(RMS)
IF
IFSM
PD
RθJA
TJ
20
2
9
250
480
400
-40 ~ +125
V
V
A
A
mW
°C/W
°C
Unit
Electrical Characteristics (At Ta=25°C, unless otherwise noted)
Reverse breakdown voltage
Reverse current
Forward voltage (Note 1)
Total capacitance
20
V
μA
pF
Conditions
VR = 4V, f = 1MHz
V(BR)
IR
VF
Ctot
100
120
IR = 1mA
VR = 10V
VR = 20V
IF = 1A
Storage temperature range
TSTG
-55 ~ +150
°C
V
0.45
0.55
IF = 2A
SOD-323
0.000 (0.00)
CDBV220-G
208
(Note 1)
(Note 2)
(Note 1)
(Note 2)
14
Note: (1) Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Note: (1)
300
Pulse test: tp
μs ; δ
0.02
80
Parameter
Max.
Symbol
Min.
(2) Device mounted on an FR4 PCB with copper pad 10 x 10 mm.
QW-BB050
Page 1
REV: A
Comchip Technology CO., LTD.
Company reserves the right to improve product design , functions and reliability without notice.


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