LP38691, LP38693, LP38691-Q1, LP38693-Q1

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SNVS321O – JANUARY 2005 – REVISED DECEMBER 2015

7.5 Thermal Information

LP38691

LP38693

LP3869x

TO-252

WSON

SOT-223

UNIT

3 PINS

6 PINS

5 PINS

(2)

Junction-to-ambient thermal resistance

50.5

50.6

68.5

°C/W

Junction-to-case (top) thermal resistance

52.6

44.4

52.2

°C/W

Junction-to-board thermal resistance

29.7

24.9

13.0

°C/W

Junction-to-top characterization parameter

4.8

0.4

5.5

°C/W

Junction-to-board characterization parameter

29.3

25.1

12.8

°C/W

Junction-to-case (bottom) thermal resistance

1.5

5.4

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance, High-K.

7.6 Electrical Characteristics

maximum limits are specified through testing, statistical correlation, or design.

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

–2

2

Output voltage tolerance

–4

4

Full operating temperature range

0.03

Output voltage line

%/V

0.1

Full operating temperature range

1.8

Output voltage load

%/A

5

Full operating temperature range

80

430

145

Full operating temperature

725

range

65

330

(4)

mV

110

Full operating temperature

550

range

45

250

100

Full operating temperature

450

range

(1)

Typical numbers represent the most likely parametric norm for 25°C operation.

(2)

Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(3)

Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1 mA to

full load.

(4)

Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100 mV of nominal value.

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