1000

10000

100000

1000000

10000000

95

105

115

125

135

145

Operating Junction Temperature (°C)

100

80

60

40

20

Duty Cycle

TPS50601-SP

SLVSD45 – DECEMBER 2015

www.ti.com

7.6 Dissipation Ratings

See

(1) (2) (3) (4)

PACKAGE

JUNCTION TO AMBIENT

JUNCTION TO CASE (THERMAL PAD)

JUNCTION TO BOARD

HKH

39.9°C/W

0.52°C/W

43.1°C/W

(1)

Maximum power dissipation may be limited by overcurrent protection

(2)

distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below

150°C for best performance and long-term reliability. See power dissipation estimate in Application and Implementation for more

information.

(3)

Test board conditions:

(a) 2.5 inches × 2.5 inches, 4 layers, thickness: 0.062 inch

(b) 2-oz. copper traces located on the top of the PCB

(c) 2-oz. copper ground planes on the 2 internal layers and bottom layer

(d) 40.010-inch thermal vias located under the device package

(4)

For information on thermal characteristics, see SPRA953.

A.

See data sheet for absolute maximum and minimum recommended operating conditions.

B.

Product operating life design goal is >15 years for 65°C

MIL-PRF-38535.

C.

The predicted operating lifetime versus junction temperature is based on reliability modeling using electromigration as

the dominant failure mechanism affecting device wearout for the specific device process and design characteristics.

Figure 1. 6-A Continuous Current Estimated Device Life

10

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