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5962-1022101VSC Datasheet(PDF) 10 Page - Texas Instruments |
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5962-1022101VSC Datasheet(HTML) 10 Page - Texas Instruments |
10 / 40 page 1000 10000 100000 1000000 10000000 95 105 115 125 135 145 Operating Junction Temperature (°C) 100 80 60 40 20 Duty Cycle TPS50601-SP SLVSD45 – DECEMBER 2015 www.ti.com 7.6 Dissipation Ratings See (1) (2) (3) (4) RθJA THERMAL IMPEDANCE, RθJC THERMAL IMPEDANCE, RθJB THERMAL IMPEDANCE, PACKAGE JUNCTION TO AMBIENT JUNCTION TO CASE (THERMAL PAD) JUNCTION TO BOARD HKH 39.9°C/W 0.52°C/W 43.1°C/W (1) Maximum power dissipation may be limited by overcurrent protection (2) Power rating at a specific ambient temperature, TA, should be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below 150°C for best performance and long-term reliability. See power dissipation estimate in Application and Implementation for more information. (3) Test board conditions: (a) 2.5 inches × 2.5 inches, 4 layers, thickness: 0.062 inch (b) 2-oz. copper traces located on the top of the PCB (c) 2-oz. copper ground planes on the 2 internal layers and bottom layer (d) 40.010-inch thermal vias located under the device package (4) For information on thermal characteristics, see SPRA953. A. See data sheet for absolute maximum and minimum recommended operating conditions. B. Product operating life design goal is >15 years for 65°C ≤ TJ ≤ 95°C based on silicon technology characterization per MIL-PRF-38535. C. The predicted operating lifetime versus junction temperature is based on reliability modeling using electromigration as the dominant failure mechanism affecting device wearout for the specific device process and design characteristics. Figure 1. 6-A Continuous Current Estimated Device Life 10 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPS50601-SP |
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