TLP5214

2015-12-26

13

PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &

GENERAL STORAGE

(1) Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

1) When Using Soldering Reflow

An example of a temperature profile when lead(Pb)-free solder is use

An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

 Reflow soldering must be performed once or twice.

 The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow

 Apply preheating of 150 °C for 60 to 120 seconds.

 Mounting condition of 260 °C or less within 10 seconds is recommended.

 Flow soldering must be performed once

3) When using soldering Iron

 Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not

exceeding 350 °C.

 Heating by soldering iron must be only once per 1 lead