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Product Data Sheet

STW7C2SB

– Mid-Power LED

 “제품 명 – 제품 군” 을 기입하십시오.

제품 군은 홈페이지 응용분야 분류기준을 참고한다.

(예) SZ5M0WWC9 – High-power LED

28

글씨체는 : Arial, 10pt

 Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….

• Final 승인원: 1.0 부터 시작

• 기존에서 일부 수정: +0.1

• 새로운 Data 추가 /또는 기존 것 삭제: +1.0

 수정일자 표기형식; YYYY-MM-DD

(예) 2013-04-01

Rev2.0, Dec 3, 2015

Precaution for Use

SSC

표준화결론(개선후)

TOP & SIDETOP & SIDE

MSL (Moisture Sensitive Level)

LEVEL 3

LEVEL 2a

1. Shelf life in Sealing bag

저장기한

(

실링백 상태로)

Months

개월

12

개월

12

개월

Temperature

(maximum)

온도 (이하)

30℃

30℃

Humidity

(maximum)

습도 (미만)

50%RH

50%RH

2. Peak package body temperature

(

제품 최대 온도)

240℃

240℃

3. After this bag is

opened

실링백 개봉 후 조건

hours

시간 (이내)

168 hours

(7days)

672 hours

(28days)

Temperature

(maximum)

온도 (이하)

30℃

30℃

Humidity

(less than)

습도 (미만)-규격

Limit

성격

60%RH

60%RH

Stored

저장조건(미만)

10%RH

10%RH

4. Devices require bake,

before mounting, if:

사용 전 Baking 검사

a. Humiduty

Indicator Card

30%RH

30%RH

Temperature

온도 조건에서

23

±5℃

23

±5℃

b. is not met.

MSL Level (

미만)

3

3

5. If baking is required,

건조(baking) 조건

hours

시간 (이내)

10~24

hours

10~24

hours

Temperature

온도 조건

65

±5℃

65

±5℃

Humidity

(less than)

습도조건 (미만)

10%RH

10%RH

<PKG용>

- 제품에 해당하는 내용 추가 및 수정하십시오.

(1) Storage

To avoid the moisture penetration, we recommend store in a dry box with a desiccant.

The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of

RH50%.

(2) Use Precaution after Opening the Packaging

Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency.

Pay attention to the following:

a. Recommend conditions after opening the package

- Sealing

- Temperature : 5 ~ 30℃ Humidity : less than RH60%

b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant

changes, components should be dried for 10-24hr at 65±5℃

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering.

(4) Do not rapidly cool device after soldering.

(5) Components should not be mounted on warped (non coplanar) portion of PCB.

(6) Radioactive exposure is not considered for the products listed here in.

(7) Gallium arsenide is used in some of the products listed in this publication.

These products are dangerous if they are burned or shredded in the process of disposal.

It is also dangerous to drink the liquid or inhale the gas generated by such products when

chemically disposed of.

(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.

When washing is required, IPA (Isopropyl Alcohol) should be used.

(9) When the LEDs are in operation the maximum current should be decided after measuring

the package temperature.