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C1HQ-4N7S-10 Datasheet(PDF) 4 Page - Superworld Electronics

Part # C1HQ-4N7S-10
Description  CERAMIC CHIP INDUCTORS
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Manufacturer  SUPERWORLD [Superworld Electronics]
Direct Link  http://www.superworld.com.sg
Logo SUPERWORLD - Superworld Electronics

C1HQ-4N7S-10 Datasheet(HTML) 4 Page - Superworld Electronics

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NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
28.01.2015
C1HQ SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
If wave soldering is used ,there will be some risk.
8-2.2 Soldering Iron (Figure 2) :
8-2.1 Lead Free Solder Re-flow :
Note.
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
Recommended temperature profiles for re-flow soldering in Figure 1.
Products attachment with soldering iron is discouraged due to the inherent process Control limitations. In the event that
a) Preheat circuit and products to 150° C.
b) 350° C tip temperature (max)
c) Never Contact the ceramic with the iron tip
a soldering iron must be employed the following precautions are reCommended.
Note :
8-2. Soldering
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4 ~ 5 secs.
d) 1.0mm tip diameter (max)
under mechanical stress as warping the board.
the mechanical stress to prevent failure.
Products shall be positioned in the sideway direction against
PC board should be designed so that products are not sufficient
Figure 2. Hand Soldering : 1 times max
G rad ual
C0oling
Over 1min.
350
150
Preheating
Soldering
Cooling
Natural
Within 4~5s
L
G
Figure 1. Re-flow Soldering : 3 times max
Time(sec.)
60~150s
20~40s
Soldering
4 80s max.
60~180s
150
25
TP(260° C/40s max.)
217
200
Preheating
Cooling
Natural
CERAMIC CHIP INDUCTORS
0.50~0.55
GH
Unit:m/m
1.55
L
0.60~0.70
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk


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