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UC3846NG4 Datasheet(PDF) 4 Page - Texas Instruments

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Part No. UC3846NG4
Description  Current Mode PWM Controller
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
Logo TI1 - Texas Instruments

UC3846NG4 Datasheet(HTML) 4 Page - Texas Instruments

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UC1846, UC1847, UC2846
UC2847, UC3846, UC3847
SLUS352C – JANUARY 1997 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply Voltage (Pin 15)
40
V
Collector Supply Voltage (Pin 13)
40
V
Output Current, Source or Sink (Pins 11, 14)
500
mA
Analog Inputs (Pins 3, 4, 5, 6, 16)
–0.3
+VIN
V
Reference Output Current (Pin 2)
–30
mA
Sync Output Current (Pin 10)
–5
mA
Error Amplifier Output Current (Pin 7)
–5
mA
Soft Start Sink Current (Pin 1)
50
mA
Oscillator Charging Current (Pin 9)
5
mA
Power Dissipation at TA = 25°C
1000
mW
Power Dissipation at TC = 25°C
2000
mW
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VREF terminal external capacitance
1
2.2
µF
6.4 Thermal Information
UCx846/7
N or DW (PDIP or
J or DW (CDIP or
THERMAL METRIC(1)
UNIT
SOIC)
SOIC)
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
41.8
73.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
28.5
34.2
°C/W
RθJB
Junction-to-board thermal resistance
21.8
38.0
°C/W
ψJT
Junction-to-top characterization parameter
13.0
7.7
°C/W
ψJB
Junction-to-board characterization parameter
21.7
37.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: UC1846 UC1847 UC2846 UC2847 UC3846 UC3847


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