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LP38691-ADJ, LP38693-ADJ, LP38691-ADJ-Q1, LP38693-ADJ-Q1

SNVS324K – JANUARY 2005 – REVISED JANUARY 2016

www.ti.com

Product Folder Links: LP38691-ADJ LP38693-ADJ LP38691-ADJ-Q1 LP38693-ADJ-Q1

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Copyright © 2005–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

If used in a dual-supply system where the regulator load is returned to a negative supply, the OUT pin must be diode clamped to

ground.

(4)

At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a

heatsink is used). When using the WSON package, refer to Leadless Leadframe Package (LLP) (SNOA401) and the WSON Mounting

section in this data sheet. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal

shutdown.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.3

12

V

(3)

Internally limited

V

Internally limited

V

Junction temperature

–40

150

°C

−65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings: LP38691-ADJ, LP38693-ADJ

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 ESD Ratings: LP38691-ADJ-Q1, LP38693-ADJ-Q1

VALUE

UNIT

Electrostatic discharge

2000

V

6.4 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

2.7

10

V

Operating junction temperature

−40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Conductivity Test Board for Leaded Surface Mount Packages.

(3)

6.5 Thermal Information

LP3869x-ADJ

LP38693-ADJ

UNIT

WSON

SOT-223

6 PINS

5 PINS

(2)

Junction-to-ambient thermal resistance, High-K

50.6

°C/W

Junction-to-case (top) thermal resistance

44.4

52.2

Junction-to-board thermal resistance

24.9

13.0

Junction-to-top characterization parameter

0.4

5.5

Junction-to-board characterization parameter

25.1

12.8

Junction-to-case (bottom) thermal resistance

5.4

n/a