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LM53600LQDSXRQ1 Datasheet(PDF) 41 Page - Texas Instruments |
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LM53600LQDSXRQ1 Datasheet(HTML) 41 Page - Texas Instruments |
41 / 44 page www.ti.com PACKAGE OUTLINE C A A 10X 0.3 0.2 2.4±0.1 10X 0.5 0.3 2X 2 1.65±0.1 8X 0.5 0.8 MAX 0.05 0.00 A 3.05 2.95 B 3.05 2.95 (0.2) TYP (0.08) (0.05) 4X (0.25) 2X (0.5) WSON - 0.8 mm max height DSX0010A PLASTIC SMALL OUTLINE - NO LEAD 4221651/A 10/2014 PIN 1 INDEX AREA SEATING PLANE 0.05 C 1 5 6 10 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 4.000 SCALE 30.000 SECTION A-A SECTION A-A TYPICAL |
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