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LM536003QDSXRQ1 Datasheet(PDF) 42 Page - Texas Instruments |
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LM536003QDSXRQ1 Datasheet(HTML) 42 Page - Texas Instruments |
42 / 44 page www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 10X (0.25) 10X (0.6) (2.4) (2.8) 8X (0.5) (1.65) ( ) VIA TYP 0.2 (0.575) (0.95) (3.4) (0.5) 4X (0.25) WSON - 0.8 mm max height DSX0010A PLASTIC SMALL OUTLINE - NO LEAD 4221651/A 10/2014 SYMM 1 5 6 10 SYMM LAND PATTERN EXAMPLE SCALE:20X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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