Document Number: 001-95418 Rev. *A

Page 5 of 16

Capacitance

Parameter [8]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Parameter [8]

Description

Test Conditions

32-pin SOIC

Package

32-pin TSOP II

Package

Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

four-layer printed circuit board

51.79

79.03

C/W

Thermal resistance

(junction to case)

25.12

17.44

C/W

AC Test Loads and Waveforms

Figure 2. AC Test Loads and Waveforms [9]

3.0 V

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

V

Equivalent to:

THEVENIN

EQUIVALENT

ALL INPUT PULSES

R1

Parameter [8]

2.5 V

3.0 V

5.0 V

Unit

R1

16667

1103

1800



R2

15385

1554

990



8000

645

639



1.20

1.75

1.77

V

Notes

8. Tested initially and after any design or process changes that may affect these parameters.